Description
iPolish, Inc.
Senior Electrical & Hardware Engineer
Full-Time Mid-to-Senior Level On-Site / Hybrid
LOCATION
Orlando, FL
EMPLOYMENT TYPE
Full-Time
DEPARTMENT
Engineering
About iPolish
iPolish, Inc. is a Central Florida digital beauty technology company pioneering electrophoretic display (EPD)-based color-changing cosmetic products, including digitally programmable press-on nails and the Magic Wand handheld programming device. We operate at the intersection of advanced materials science, consumer electronics, and fashion-tech, with manufacturing partners in China, Taiwan, USA, Japan and Mexico and a product roadmap targeting simultaneous launch across North American, European, and Asia-Pacific markets.
Position Overview
We are seeking an experienced Senior Electrical & Hardware Engineer to lead the design, prototyping, and bring-to-market of mixed-signal embedded systems at the core of the iPolish® product platform. This role is central to the continued development of the Magic Wand device — a compact, battery-powered wireless EPD programmer — as well as next-generation iPolish press on nail display hardware. You will work directly with the founders across the full hardware development lifecycle, from schematic capture through DFM, multi-market regulatory certification, and volume manufacturing. This role carries significant international compliance coordination responsibility: iPolish products are wireless, battery-powered, and skin-adjacent, and the successful candidate will help drive certification and market-access programs across the US, Canada, UK, EU, and Asia-Pacific.
Key Responsibilities
Own schematic capture and PCB layout for compact, battery-powered consumer electronics products, including the Magic Wand (ESP32-C6-class Wi-Fi/BLE SoC, LiPo power system, high-voltage EPD source/gate drivers)
Design and validate low-voltage analog/mixed-signal circuits, including power-path management (ideal-diode ORing, PFET mux, LDOs), high-voltage EPD driver rails (±30 V class VGH/VGL supplies), and USB-C charging topologies
Perform component voltage-rating and derating audits, tolerance analysis, and FMEA; maintain design verification test plans for reliability and safety compliance
Lead design-for-manufacturing (DFM) reviews and coordinate with overseas CM partners (China, Taiwan, Mexico) on PCB fabrication, panelization, SMT assembly, and functional test infrastructure — including bed-of-nails / spring-pin programming and test fixtures
Develop and maintain full Bills of Materials (BOM) and CPL/placement files with preferred and alternate sourcing, DigiKey / LCSC / Mouser cross-references, and formal component change documentation (ECOs, CCNs)
Coordinate international wireless and product-safety certification programs end-to-end: FCC and ISED (Canada), CE RED and UKCA, SAR testing, MIC/Giteki (Japan), SRRC (China), and emerging EU radio-equipment cybersecurity requirements (EN 18031 series); manage test-house relationships, technical files, and Declarations of Conformity
Support battery and product safety compliance, including UN 38.3 transport testing, pack-level certification (UL 2054 / IEC 62133 class), and safety-relevant component selection (e.g., glow-wire-compliant connectors)
Track evolving market-access requirements (EU GPSR, EU Battery Regulation labeling and marking phases, RoHS/REACH) and translate them into actionable design and documentation changes
Collaborate on firmware-hardware integration with embedded software developers; review strapping-pin and boot configurations, bring-up procedures, and factory calibration and programming flows
Contribute to IP documentation and patent prosecution support as needed, working with outside counsel and RocketPatent LLC
Manage hardware project timelines, milestone tracking, and cross-functional dependencies across engineering, operations, and external vendors; maintain schedules from prototype build through production release
Author and maintain technical project documentation including design history files, ECO logs, component change notices, and design review packages
Requirements
Required Qualifications
B.S. or M.S. in Electrical Engineering, Computer Engineering, or equivalent
5+ years of hands-on hardware product development experience with consumer electronics or IoT devices
Proficiency in schematic capture and PCB layout; Fusion 360 Electronics / EAGLE experience strongly preferred (Altium or KiCad acceptable with willingness to work in the company toolchain)
Demonstrated experience with ESP32 or equivalent Wi-Fi/BLE SoC families; familiarity with Nordic nRF52-class BLE SoCs a plus
Experience with battery-powered products: LiPo charging/protection, power-path management, thermal and safety design
Solid understanding of EMC principles and direct experience supporting FCC/CE certification campaigns, including pre-scan, test-house liaison, and remediation
Working knowledge of international market-access frameworks for wireless consumer products (radio, safety, battery, and labeling requirements) and ability to coordinate multi-country certification schedules
Comfort working in a fast-paced startup environment with hands-on prototyping and bench testing
Preferred Qualifications
Experience with electrophoretic displays (E Ink-class, SiPix, or custom EPD) or high-voltage display driver ICs, including waveform and supply-rail design considerations
Background in manufacturing engineering, DFM, or factory bring-up at contract manufacturers in Asia or Mexico
Experience with RF antenna variants and conducted/radiated test configurations (e.g., U.FL/W.FL test ports for certification builds)
Familiarity with HTS classification, tariff structures, and Taiwan/China supply chain logistics
Experience contributing to patent applications, IP disclosures, or FTO analyses
Prior use of LCSC, DigiKey, and Mouser for component sourcing, cross-referencing, and lifecycle management
Familiarity with project management methodologies (Agile, stage-gate, or hybrid); experience using engineering task-tracking tools
Experience managing external vendors, test labs, or CM partners to schedule and deliverable commitments
Background in semiconductor or IC manufacturing processes — including wafer fabrication, packaging, or BEOL operations — with the ability to evaluate component-level design margins and interface effectively with IC vendors on custom or semi-custom silicon
Work Environment & Perks
Direct collaboration with the founding team on industry-first EPD beauty technology
Competitive compensation commensurate with experience; equity participation available
Flexible hybrid arrangement after initial onboarding period
Opportunity to own key technical domains and grow into a technical leadership role as the company scales
To Apply
Submit your resume, a brief cover letter, and any relevant portfolio materials (PCB screenshots, product photos, certification letters) to careers@ipolish.fashion with the subject line: Senior EE – [Your Name].
